Defects production and annealing in self-implanted Si
نویسندگان
چکیده
230-keV 28Si ions were implantated into Si( 100) at room temperature with doses from 1014 to 101*/cm2. The samples were analyzed by x-ray double crystal diffractometry and 2-MeV 4He ion channeling spectrometry. The implanted layer has a parallel lattice spacing equal to that of the unimplanted substrate. The perpendicular lattice spacing is larger than that of the unimplanted substrate and is proportional to the defect concentration extracted from the channeling measurement. Both the perpendicular lattice spacing and the defect concentration increase nonlinearly with ion dose. The defect concentration initially increases slowly with dose until a critical value ( 15%, at 4~ 10’4/cm2), then rises rapidly, and finally a continuous amorphous layer forms. The initial sluggish increase of the damage is due to the considerable recombination of point defects at room temperature. The rapid growth of the defect concentration is attributed to the reduction of the threshold energy for atomic displacement in a predamaged crystal. The amorphization is envisioned as a cooperative process initiated by a spontaneous collapse of heavily damaged crystalline regions. The annealing behavior of the damaged layer reveals various stages of defect recovery, indicating that the damage consists of a hierarchy of various defect structures of vacancy and interstitial aggregates.
منابع مشابه
Self-consistent determination of the perpendicular strain profile of implanted Si by analysis of x-ray rocking curves
Results of a determination of strain perpendicular to the surface and of the damage in ( 100) Si single crystals irradiated by 250-keV Ar + ions at 77 K are presented. Double-crystal x-ray diffraction and dynamical x-ray diffraction theory are used. Trial strain and damage distributions were guided by transmission electron microscope observations and Monte Carlo simulation of ion energy deposit...
متن کاملDamage production and annealing in 28Si-implanted CoSi,/Si(l 11) heterostructures
The damage in epitaxial Co& films 500 nm thick grown on Si( 111) produced by roomtemperature implantation of 150 keV **Si were investigated by 2-MeV 4He channeling spectrometry, double-crystal x-ray diffractometry, and electrical resistivity measurements. The damage in the films can be categorized into two types. In lightly (heavily) damaged CoSi, the damage is in the form of point-like (extend...
متن کاملEffect of ion mass on the evolution of extended defects during annealing of MeV ion- implanted p-type Si
متن کامل
Defects in Ge and Si caused by 1 MeV Si+ implantation
Cross-sectional transmission electron microscopy was used to study defect formation and evolution in the !001" Ge and Si wafers implanted with 1 MeV Si+ and 40 keV Si+ at a dose of 1 !1014 cm−2. As expected, upon annealing, the #311$ extended defects form and subsequently dissolve at the projected range for nonamorphizing implants into Si. However, in Ge, no #311$ defect formation is observed f...
متن کاملHydrogen plasma treatment of silicon thin-film structures and nanostructured layers
The review concentrates on the analysis of the RF hydrogen plasma effect on thin-film metal-dioxide-silicon and silicon-dioxide silicon structures which are a modern basis of microand nanoelectronics. The especial attention is paid to athermic mechanisms of transformation of defects in dioxide, SiO2-Si interface and SiO2-Si nanocrystal ones and thin layers of silicon; atomic hydrogen influence ...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
عنوان ژورنال:
دوره شماره
صفحات -
تاریخ انتشار 1999